Multilateral Alignment of Technology Controls on Hardware (MATCH) Act

This bill requires the U.S. government to identify critical semiconductor manufacturing equipment and facilities, engage allies to adopt similar export controls, and impose U.S. controls if diplomatic efforts fail, with annual reporting and oversight.

Sec. 3, Identifying chokepoints: Within 60 days and annually, the Secretary of Commerce and Secretary of State must review and list all covered semiconductor manufacturing equipment and facilities, notify Congress and the public.

Sec. 3, Diplomatic engagement: The agencies must immediately push allied supplier countries to adopt countrywide controls on such equipment and deny licenses for exports to covered facilities, and brief Congress within 90 days on progress and incentives.

Sec. 3, Application of controls and exhaustion of diplomatic recourse: Within 150 days, Commerce must impose U.S. countrywide controls on covered equipment and end-user restrictions on covered facilities in countries of concern. For each allied supplier country, the agencies must certify either that the country has adopted equivalent controls, or that diplomacy has failed and delay harms national security. If certification shows failure, Commerce must extend U.S. controls to equipment from that country, require licenses for servicing, and restrict exports to covered facilities. A one-time 90-day waiver is possible with Defense and Energy concurrence.

Sec. 3, Report: Within 180 days and annually, the agencies must report to Congress listing all covered equipment and facilities, scope of controls by the U.S. and allies, diplomatic efforts, and certify that exports to countries of concern or covered facilities require a denied license.

Sec. 3, Termination and reimposition: Commerce may end or modify controls on allied country items if that country adopts equivalent controls, but must reimpose them within 60 days if the country weakens those controls.

Sec. 3, Rule of construction: This bill does not limit Commerce's existing authority under the Export Control Reform Act.

Sec. 3, Definitions: Key terms are defined, including advanced-node integrated circuits, allied supplier country, applicable item, country of concern, countrywide controls, covered facility, covered semiconductor manufacturing equipment, and servicing.